Click Here to Download: https://ouo.io/C7pk5t 3D Stacked Chips From Emerging Processes to Heterogeneous Systems By: Ibrahim (Abe) M. Elfadel Publisher: Springer Print ISBN: 9783319204802, 3319204807 eText ISBN: 9783319204819, 3319204815 Copyright year: 2016 Format: PDF Available from $ 99.00 USD SKU 9783319204819 This book explains for readers how 3D chip stacks promise to increase the level of on-chip integration, and to design new heterogeneous semiconductor devices that combine chips of different integration technologies (incl. sensors) in a single package of the smallest possible size. The authors focus on heterogeneous 3D integration, addressing some of the most important challenges in this emerging technology, including contactless, optics-based, and carbon-nanotube-based 3D integration, as well as signal-integrity and thermal management issues in copper-based 3D integration. Coverage also includes the 3D heterogeneous integration of power sources, photonic devices, and non-volatile memories based on new materials systems.
