Click Here to Download: https://ouo.io/EHQvXSx Design-for-Test and Test Optimization Techniques for TSV-based 3D Stacked ICs By: Brandon Noia; Krishnendu Chakrabarty Publisher: Springer Print ISBN: 9783319023779, 3319023772 eText ISBN: 9783319023786, 3319023780 Copyright year: 2014 Format: EPUB Available from $ 109.00 USD SKU 9783319023786 This book describes innovative techniques to address the testing needs of 3D stacked integrated circuits (ICs) that utilize through-silicon-vias (TSVs) as vertical interconnects. The authors identify the key challenges facing 3D IC testing and present results that have emerged from cutting-edge research in this domain. Coverage includes topics ranging from die-level wrappers, self-test circuits, and TSV probing to test-architecture design, test scheduling, and optimization. Readers will benefit from an in-depth look at test-technology solutions that are needed to make 3D ICs a reality and commercially viable.
